See Photos: Leaked Specification Of LeEco Flagship Device With 6GB RAM and 256GB Internal Storage

LeEco Seems to be working on something big, which they are keep away from the public to a release of their new flagship was Leaked online. This device is a monster device when it comes to the RAM and Internal Storage of this device.

The LeEco smartphone is said to sport Qualcomm’s latest Snapdragon 835 chip. The device is said to be very thin, and we can spot a USB Type-C port on the bottom next to a speaker grille,



But there's no 3.5mm headset jack to be seen. the camera is said to also be a top notch dual lens setup made up of a black and white as well as color shooter.

The device is said to pack 6GB Ram and 256GB internal storage. The phone comes with a beautiful design, packing a curved edge/ hyperboloid display and some powerful hardware. Although this device full specification was not leaked but will be available once the device is officially Released.